The Electronics Group of Henkel continues to expand its halogen-free materials portfolio with the launch of Loctite Multicore HF 212, a halogen-free, lead-free solder paste ideal for today’s high-value PCB assemblies. The new paste contains zero deliberately added halogen and is under the limit of detection for chlorine and bromine when subjected to rigorous testing, says the company. With consistent print performance and minimal hot slump – even in regions with temperatures that exceed 86°F (30°C) and relative humidity (RH) as high as 80 percent – the product offers exceptional stability and environmental adaptability. The material exhibits extremely low voiding in CSP via-in-pad joints, good coalescence and excellent solderability over a wide range of surface finishes including Ni/Au, Immersion Sn, CuNiZn, Immersion Ag and OSP copper. Since its introduction, the company says the new paste has been steadily enabling more robust printing processes at manufacturers around the globe. For US vehicle safety lighting manufacturer, Missouri-based Peterson Manufacturing, Loctite Multicore HF 212 delivers on numerous fronts, not the least of which is cost savings. The product is optimized for use on components with pitches of 0.3mm and greater and is an ideal material for larger, high-value boards often used in industrial, networking and lighting applications. What’s more, the novel solder paste has been proven to deliver excellent wetting results on parts such as CuNiZn shields that can be particularly problematic for alternative paste materials. This alloy is commonly used in RF shielding applications.
