Essemtec has introduced a new SMT production centre for the jetting of solder paste instead of printing – saving costs for stencils and enhancing the production flexibility especially for lower to midsize volumes. Until now, separate machines have to be bought to fulfil this requirement, says Essemtec, which is merging its dispensing and pick-and-place know how of the Scorpion and Paraquda machines into an SMT production centre for high productivity. The company states jet printing is faster (up to 80’000 dots/h) and more precise than any other dispensing system for solder pastes. So far, jetting of pastes has only been possible with specially designed, costly solder pastes. The new system from Essemtec opens the range of pastes to most type 4, 5, 6 or 7 pastes. The combination of jet printing with pick-and-place eliminates the need to program two different machines and reduces the investment costs dramatically. Set up is done directly from CAD data using an integrated paste library. Production is fully automated and the application of solder paste and the placement of components are seamlessly integrated while process monitoring ensures high quality results.
