A supplier of advanced soldering materials to the global market, Nihon Superior, says the reliability of its SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow. SN100C P506 D4 is a lead-free (Sn-Cu-Ni-Ge) no-clean solder paste that can be stored at room temperature for more than 150 days without deterioration. This new material will not only simplify stock management, but also improve productivity with excellent consecutive printability, says the company.
