R&D focus for Smart Systems Integration 2015
Top speakers from industry and science present their latest research results and developments during the two-day conference being held at Smart Systems Integration 2015 from 11 – 12 March in Copenhagen, Denmark. The 9th European Conference & Exhibition focuses on integration issues of miniaturized systems – MEMS, NEMS, ICs and Electronic Components
Presentations this year will deal with innovations, applications and trends on the following topics with high actuality:
• Smart energy systems
• Smart medtech systems
• Smart production
• System integration and packaging
The conference is organized in cooperation with the Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz and EPoSS – The European Technology Platform on Smart Systems Integration, Berlin. The cooperation with both institutes ensures a consistently high quality of the presentations, as well as the focus on current topics and trends.
Essemtec highlights 3-in-1 multi-functional SMT center
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging developed a combined SMT production center that is able to jet solder paste and/or glue and mount components in one machine. Paraquda pick and place system is one machine platform processes all types of components – from 01005 to large components or connectors. Unmatched changeover times and a highly flexible assembly are ensured by the highest number of feeder slots (240) per square meter in the market, intelligent, servo-driven kitting without production stop, and an intuitive, touch screen-based operation.Paraquda platforms are available in different models. Modular construction allows for a gradual increase in performance – first by placement head choice and second by multiplication of modules as well as an expansion by means of options according to the requested applications.
Assembléon advances pick-and-place solutions
Assembléon, a Kulicke & Soffa Business Line, recently introduced its advanced pick-and-place solutions. The iFlex T2 and H1 systems offer best in class flexibility, fast changeover and the lowest defect per million (DPM) rates in the industry. These advanced solutions can place all types of passive and discrete SMT components and also handle multifunctional and end-of-line placements. The Hybrid 3 is an advanced packaging solution that combines the lowest DPM with the highest accuracy. It achieves a placement accuracy of less than 10 µm, making it ideal for wafer level packaging, SiP, MCM, flip-chip modules and embedded components. Having evolved from the high speed AX/iX product family, the Hybrid 3 is also fully capable of placing traditional SMT components at volume. All the machines at the exhibition include a standard list of advanced features, such as Constant Component Monitoring and Active Closed-loop Placement Force Control. They are also easily integrated into factory processes using Assembléon’s advanced software solutions.
LPKF presents 2D and 3D prototyping
From the idea to the close-to-production prototype in just one day – for PCBs and 3D MID components. LPKF focuses on in-house prototyping processe for the manufacture of three-dimensional molded interconnect devices utilizing the LDS process (LDS paint, ProtoLaser 3D and instant metallization).The LPKF ProtoMat D104 also creates ultra-fine structures without etching chemicals
LPKF will showcase its ProtoMat D104 top model circuit board plotter for the manufacture of PCB prototypes that eliminates the need for environmentally harmful etching chemicals. These systems mill conductor tracks from a fully coated substrate and simultaneously implement drilling tasks. Along with its mechanical tools, the ProtoMat D104 features an additional laser, which allows high-precision geometries to be realized and is used to create ultra-fine conductor structures.
Goepel electronics debuts new module for test of high-speed interfaces
Goepel electronics has introduced a universally adaptable tester which confirms the claims of various high-speed I/O (HSIO) interfaces. The ChipVORX module FXT-X32/HSIO4 allows testing at board level – from the inside, both in the lab and in production. It supports the interfaces GBit Ethernet, PCIe, USB 3.0 and SATA, with transfer rates in the gigabit range. The module is serially controlled and can be connected to any Test Access Port (TAP). Heart of the module is an FPGA from Xilinx. Thereby, all for this FPGA existing ChipVORX models can be used. This allows equipping the module with specific test functions for the supported interfaces. Four slots make the module fully configurable. In addition, even specific interface types can be connected through individual adapter cards. The Boundary Scan software SYSTEM CASCON enables automatic test generation and test execution. As test functions, Bit Error Rate Tests (BERT) and static eye diagram can be performed. This makes the FXT-X3/HSIO4 a flexible external tool for various testing requirements and provides distinct advantages compared to conventional functional tests
Saki signs with Lean Stream for SMT manufacturing
Saki Corporation, an innovator in the field of automated optical inspection equipment, announces that it has expanded its operations in the Americas. As part of the expansion, Saki America has signed an agreement with Lean Stream LLC to be its representative for the western United States. Lean Stream provides LEAN solutions to meet the SMT manufacturing needs of the EMS and OEM community in Northern California, Nevada, and the Pacific Northwest. They will represent Saki’s complete line of 2D and 3D automated optical, x-ray, and solder paste inspection systems. Lean Stream represents companies such as Fuji pick-and-place systems and other “top-line” equipment and DFM software manufacturers for the circuit board assembly industry to help transform and improve electronics manufacturing efficiencies with innovative tools, services, and lean practices that directly and positively impact the bottom line for its customers.
Henkel advances in form and function for printed electronics
Henkel is introducing a range of new printed ink formulations that address emerging requirements for improved form and function of printed electronics applications.
Delivering a streamlined alternative to conventional copper wire and printed carbon materials, Henkel has developed a portfolio of novel positive temperature coefficient (PTC) printable inks that provide exceptional functionality and design flexibility for a variety of heating applications. Available in three formulations, the Loctite ECI 8000 series PTC inks offer more uniform and flexible heating, while providing improved safety through temperature self-regulation. Leveraging unique resistance technology that increases with the elevation in temperature, Loctite ECI 8000 materials are self-regulating so that the temperature will not rise above its set point. This is contrary to conventional heating methods, where a linear relationship between heating and voltage requires the use of a control unit for temperature regulation and a fuse to prevent overheating. Other benefits of the Henkel PTC inks are rapid and uniform heating, reduced weight, sustainability due to long lifecycles, and environmental stability.
Global photovoltaic shipments jump 15% in 2014
PV industry shipments grew by 15% in 2014 over 2013 to 39.3-GWp from 34.0-GWp the previous year, according to the IDTechEx/SPV Market Research annual supply report Photovoltaic Manufacturer Shipments: Capacity, Production, Prices and Revenues to 2019. Supply side inventory was 1.1-GWp at the end of 2014 and demand side inventory decreased by 400-MWp to 2.4-GWp. Defective modules removed from service were ~1.6-GWp at the end of 2014. Thin film shipments (CdTe, CIGS, a-Si) represented 7% of the global total in 2014, heavily weighted by First Solar’s CdTe technology. Figure 1 offers PV technology shares for 2011, 2012, 2013 and 2014. During the mid-2000s the European Feed in Tariff incentive model drove strong demand for photovoltaic systems and technologies. This period of strong demand coincided with a shortage of polysilicon processing capability. Constrained capacity of crystalline products and higher prices for available product spurred interest in thin film technologies and investment in these technologies ramped. It was assumed that thin film technologies would eventually be less expensive to manufacture than crystalline technologies, that conversion efficiencies for thin films would improve, and that thin films would take steadily take share from crystalline. For a couple of years it appeared that this might be the case. In 2008 thin film technologies had a 14% share, up from 7% in 2006, and in 2009 thin film’s share of global shipments increased to 17%.