A launch of the NanoSlic Gold stencil has been announced by FCT Assembly. NanoSlic is an advanced stencil technology for solder paste printing. The stencil is the next generation of stencil technology developed to address the increasing demands confronting the electronic assembly industry. The coating is based on a proprietary application process that coats both the underside of the stencil and aperture walls. This robust coating is both highly hydrophobic and oleophobic, which repels solder paste. NanoSlic Gold is thermally cured and is a permanent coating and, says FCT Assembly, the technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. In addition, the product minimizes bridging and reduces underside cleaning. This technology is compatible with current assembly equipment and processes.