A new solder paste printer RP-1 with improved accuracy and productivity of PWB solder printing, excellent for high-density packaging of downsizing electronic devices, has been debuted by Juki. The printer is a solder paste printing device for PWBs to solder components, and is a keystone to maintain good quality in assembling process. RP-1 now has improved printing accuracy and productivity due to its new “Motion Screen” mechanism that aligns PWB with a screen mask (called “mask” hereinafter). Normally, to align the position of the PWB with that of the screen, three layers of stages — X, Y and θ of PWB side — are driven independently against the fixed mask to adjust the respective position. This mechanism is not only complicated but may also cause position error. On the other hand, the newly developed “Motion Screen” drives three alignment modules attached on the outer circumference of the mask stage to adjust the position in X, Y and θ directions simultaneously in simplified structure. According to the company, this allows repetitive printing accuracy of circumference fine adjustment to improve up to ±10 μm (6σ), and duration including correction and movement time reduced to six seconds: realizing both high printing accuracy and high productivity. Additionally, optional ‘Automatic Solder Dispenser’ and ‘High-speed Cleaning’ functions are now available, enabling higher-speed printing, stable repetitive printing accuracy and reduction of environmental load.