Heraeus Electronics develops new end termination ink
A friendly, flexible passive component termination ink has been introduced by Heraeus Electronics. ET2010 Flexible End Termination Ink is a first of its kind material in the market utilizing advanced polymer technology. When compared to current thermoset, epoxy-based inks in the market, Heraeus’ solution offers easier shipping, storage, and handling at room temperatures. Manufacturers of passive electronic components, such as multi-layer ceramic capacitors, chip inductors, chip varistors, chip resistors and chip fuses are accustomed to handling electrode and termination inks in room temperature conditions, except for their flexible termination inks. Current flexible termination inks use epoxy based, thermoset polymers that require deep freezing and special handling conditions to keep the epoxy from reacting. Passive component requirements continue to grow with increased usage especially in the Automotive, Consumer, and Industrial electronics industries. In Automotive, current ICE automobiles contain 2000-3000 capacitors for example. This will grow by 5-10x (15-20k capacitors) in EV, and brings further focus on reliability and safety given media and financial impacts from product recalls. This also is applicable for nearly all other high reliability applications where impact testing, vibration, or thermal stability are concerns. The value (pricing) of these high-reliability components is expected to increase as well.
Yincae launches thermal underfill
Manufacturer of high-performance electronic materials, Yincae, has announced the release of its breakthrough product: thermal underfill – UF 158A2. Designed for use in a variety of electronic devices, not only can UF 158A2 replace underfill, silver epoxy paste and thermal pad/paste in one step in CoWoS package, but also provides superior protection and improved thermal management for critical components. By filling the space between the device and the PCB (Printed Circuit Board), Thermal Underfill enhances the structural integrity of the assembly while reducing stress on solder joints. UF 158A2 is ideal for use in high-reliability applications where temperature cycling, shock, and vibration can cause damage to electronic components. The product features excellent thermal conductivity and high-temperature stability, ensuring optimal performance even in the most demanding environments.
New lead-free solder paste to prevent HoP issues
Shenmao has released a new anti-HoP lead-free solder paste specially designed for the SMT process to prevent head-on-pillow (HoP) issues. The demand for ultra-thin packages has increased, thus the reduction in package thickness has caused increased warpage. The warpage during the reflow process increases the gap between BGA components and solder paste, leading to HoP issues and production yield loss. PF606-P130N features great flux activity that can prevent oxidation of solder powder during the reflow process. Furthermore, the new paste shows excellent solderability and hot slump performance to cover the warpage of components and prevent BGA/CSP HoP issues.
Partnership powers material flow automation
SMT market and technology leader ASMPT has entered into a long-term partnership with automation specialist CTS to improve material flow automation in electronics production from the warehouse to the production line. CTS equipment complements ASMPT’s extensive portfolio of hardware and software solutions for electronics production with storage systems and automatic transport and handling solutions (AMR and robotics). ASMPT can thus offer more flexibility within its modular and manufacturer-independent open automation concept for more efficient and integrated electronics production. CTS’s portfolio for electronics manufacturing applications includes solutions for the automated storage of circuit board magazines as well as dedicated robotic solutions for PCB handling. It implements AMR solutions for the automated transport of materials using ASMPT’s Factory Automation Software in such a way in a non-proprietary manner so that heterogeneous fleets can execute any transportation tasks with maximum efficiency – from small loads to pallets weighing more than 1 ton. Another specialty of CTS is the development and production of standardized and customized transfer stations on SMT lines.
Celektronix deploys new solutions for OEMs
A new one-stop-shop of electronic manufacturing solutions has been introduced by Celektronix for Original Equipment Manufacturers (OEMs) in the automotive, railway, engineering, medical devices, power generation, defense and telecommunication industries. A member of the Custom Electronics, Inc. (CEI) family of companies, Celektronix meets the production requirements of the entire spectrum of the electronics industry. The company covers design and development to testing, final assembly and batch production for its customers to build, design and distribute high-quality products. The brand’s prototype and assembly services span from surface mounts, flexible circuits and through-hole PCB assembly, as well as inductor, edge winding, and transformer electromagnetics. Wiring harness capabilities include data/encoder/network cables, automobile cables/harnesses and power and sensor/transducer cables. Additionally, microcontrollers for automation, motor and pump, and intelligent power panels, as well as high voltage capacitors, electronic assemblies and encapsulated modules and component assembly are also offered.